แจ้งให้ทราบ : สินค้าประเภทเครื่องยกชิพ และ เครื่องมือวัดต่างๆ รวมถึง อุปกรณ์อื่นๆ  หากจำนวนคงเหลือมีเพียง 1 ตัว นั่นคือ เราทำรายการเพื่อให้ลูกค้าได้กดสั่งซื้อและจอง หากต้องการได้สินค้าเมื่อมาถึงเลย กรุณาโอนเงินเต็มจำนวน(รวมถึงค่าส่ง) หรือ โอนมัดจำ ในสินค้าประเภทเครื่องยกชิพ(ไม่ต้องจ่ายค่าส่ง เพราะค่าส่งเก็บปลายทางสำหรับเครื่องยกชิพ) พร้อมแจ้งรายละเอียดการโอนตามรายละเอียดที่ทำตัวอย่างไว้ให้ดูที่หน้าเวบ เมื่อสินค้ามาถึง ทางร้านจะแจ้งให้ลูกค้าทราบเพื่อโอนเงินส่วนที่เหลือและจัดส่งให้ตามลำดับ

 

 

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1: ตะกั่วเม็ดขวดเล็ก  0.35  - 1  ขวด

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7: ฟลอยอลูมิเนียม 1 ม้วน

HB-W750 rework station dedicated to laptop computer motherboard, desktop computer motherboard repair, tailored,

Easy enough, enough affordable

 

 

 

 

 

 

The world's first infrared heating element inside plus thermal asbestos and the built-in thermometer hole quality imported heater more rational design of more uniform

Heating wholeheartedly serve you.

  

Performance and specifications:

1. HB-W750 rework station dedicated to laptop computer motherboard, desktop computer motherboard repair, tailored, easy enough.

 

2. buy this rework station presented a full set of welding technology, experience, skills and solutions (specifically for laptop motherboard and

 

Desktop computer motherboards)

 

3. HB-W750 Rework Station Built- optimal heating temperature sequence , normal users do not need to personally set up sub-heating temperature Degree , the success rate is more likely to ensure welding (welding success rate of almost 100% ), completely avoid electrical burn inexperienced user errors Board .

 

4. HB-W750 innovative design rework station, do not need to connect your computer to operate very easily.

 

5. can repair a variety of CPU holder.

 

6. can replace a variety of slots.

 

7. can be very reliable replacement double BGA chip, replace BGA chips after, double BGA solder paste between the chip will not emerge.

 

8. Direct heating BGA chip plant tin ball ( because there is no air flow, so infrared heating machine is particularly suitable for

 

BGA chip plant solder ball ) .

 

9. After HB-W750 rework station heating sink ball steel mesh, steel mesh is not deformed (together with steel mesh suitable for direct heating households).

 

10. can be done drying board and board shaping.

 

11. using pure infrared heating, no air flow, plus steady heating process, a chip desoldering about 3 minutes.

 

12. The upper part of the main heating head, effective heating area 60 * 60mm. The lower part of warm-up sets for preheating PCB board to ensure Plate deformation, preheat station area 240mm * 180mm (large size can be customized according to customer demand)

13. Circuit board rack is very practical universal slider type, can easily be clamped flat structures of arbitrary complexity circuit boards,To ensure that no deformation.

 

 

Dimensions: length 470 × width 380 × height 450mm.

 

Power supply: 220V 50HZ.

 

Upper heating: 220W

 

Preheat the bottom 1400W

 

Machine power: 1400W.

 

Weight: ~20 kg .

 

  

Instructions for use

 

①,  Before turning to check the infrared radiation, temperature sensors and the power cord is connected.

 

②, Turn on the main power switch , power switch at the bottom of warm-up sets, intelligent temperature controller at 170-200 range, so that the bottom preheat 2 - 3 bell .

③, the upper radiator heating head switch for controlling infrared emitters work; temperature control panel, press the SET button, such as the value flashing, adjust the "▲" up key, "▼" key drop and lateral shift key values, in 0 - 1300 in the range ℃, arbitrarily set the required soldering temperature. Generally lead soldering upper temperature: 190-200 degrees between, lead-free soldering temperature:240-260 between.

 

Rework / Repair process:

(A) is generally removed during the operation:

① fixed PCB board;

② regulator infrared radiation temperature sensor, which was placed in the appropriate position in the vicinity of the chip or chips. Around the chip and the sensor head painted Flux (welding or soldering treasure oil), this allows the sensors to measure temperature more accurately, while fluxing action flux.

③, adjust the position of the upper body of infrared radiation, the infrared radiation is projected vertically aligned need desoldering / rework chips.Regulating infrared radiation temperature sensor, which was placed in the appropriate position in the vicinity of the chip or chips. In the chip sides and apply flux sensor head (welding or soldering treasure oil), this allows the sensors to measure temperature more accurately, while the role of flux flux, BGA pad will be more intact, can effectively prevent pads are sticky and at the beginning of tin wool and other issues. Adjust the height of the upper radiator heating head, keeping the head and upper heating desoldering object height of 20-30mm is appropriate, and then open the upper infrared emitters , for lead soldering temperature preset temperature controller 170-190 or so. Special attention to the temperature control of the welding process to prevent the displacement sensor is not allowed to lead the chip temperature leaving the heating time is too long, too high temperature, burn chips, the chip is heated to reach the preset temperature to melt tin plate or chip, a vacuum suction pen or tweezers to remove the chip, switch off infrared radiation.

⑤, etc. After welding is completed, turn off the power supply.

(2) , rework / repair of various strip bars and pin socket (such as CPU socket andGAP inserted row);

General operation are: first to rework the PCB part and not desoldering device board with aluminum foil covering the span, and then to rework the PCB board fixed, open the preheating chassis power to regulate the preheating temperature is 170 - 200 range ℃, so the bottom preheat 2-3 minutes . adjust the position of the upper body of infrared radiation, the infrared radiation is projected vertically aligned need desoldering / rework chip, the tip of the temperature sensor placed next desoldering device or on the surface of the upper radiator heating adjust the head height, keeping the head and upper heating desoldering object height of20 - 25mm is appropriate, and then open the upper infrared emitters , can be preset temperature controller temperature a 80-190 around (Lead) After desoldering device is heated evenly, generally you can rework it.

For Pb-free devices can then raise the temperature of 30 -50 ℃ can be.

For dual-panel, you can use a lower preheat temperature to preheat PCB board, supplemented by top-infrared heating can be.

(3) , the process is generally reflow operation:

Basic operation with the demolition process, except as follows: first clean solder ball pads and vegetation, properly placed chip, according to reflow solder ball preheating process temperature, reflow soldering, cool. For Pb-free devices can then raise the temperature of 20-30 ℃ can be.

4 , rework / repair process precautions and instructions:

①, for the simple chip package is recommended in the central part (wafer position) chip pre-affixed aluminum foil, to prevent overheating of silicon burst.Aluminum foil slightly larger than the size of the silicon wafer is good, not too much, otherwise it will affect the welding effect of the chip.

②, rework / repair process to ensure that the upper region of the infrared radiation is irradiated, all plastic plug covering the application of aluminum foil to prevent infrared baking temperature deformation or damage. But not all parcels.

③, reflow soldering / rework finished PCB board, etc. After cooling, then cleaned and dried and tested; If not, can come back again to weld.

④, before and after work, there is no place in the PCB board of the case, not long open upper infrared emitters, otherwise it will seriously affect the life of the radiator.

 

Considerations

1 , after the work is completed, immediately turn off the power, allowed to cool naturally.

2 , to maintain the smooth flow ventilation vents, infrared emitters and clean.

3 , high-temperature operation carefully, pay attention to safety, to prevent burns.

4 , for a long time do not use, you should unplug the power cord!