Product Name: Best white 939v vacuum suction pen SMT IC suction pen not to hurt the IC chip IC puller

Product categories: chip-level maintenance tools - motherboard repair tools

Product Description:

Can make it easier to get surrounded by pin, double-sided pin IC, IC from pulling special anti-static, no power supply and battery can be used to take electronic components and products, particularly convenient, simple operation, removal of components and with use of vacuum suction pen forceps removal of components compared to the maximum avoid Pengdiao peripheral components.

Usage: 
☆ ☆: first select corresponding to the size of the absorption and desorption IC sucker installed on the 939 sucked pen Tsui. 
☆ ☆ 2: install suction pen sucker sucker gently alignment of IC components intermediate (before a BGA component surface to be cleaned is good, otherwise it will affect the suction force of the suction pen) 
☆ ☆ 3: Press the suction pen the button pen inside the air-discharge, and then release the button pen creates a vacuum suction to suck up the IC. 
☆ ☆ 4: pick up the IC on the position to be placed, press the button, the the barrel vacuum device discharge air to make IC sucker off.

Vacuum suction pen advantages: 
1, built-in ultra-small powerful vacuum pump, without connection any straw or power lines, convenient to use at any time. 
2, the electric operation, provides a strong and stable suction, particularly suitable for the continuous drawing of work. 
3, touch the button with a pen-type design, use of comfort. 
Of anti-static design, suitable for the processing of the current sensitive components. 
5, suction with suction pads fixtures suction pad against straw pierced protection operation, but will also avoid damage to the components, to ensure quality performance of lessons.

    Particularly convenient to draw electronic parts and products, vacuum suction pen Lee atmospheric pressure difference of principle to draw a tool components, the use of vacuum suction pen removal of components with tweezers removal of components compared to maximize avoid knocked surrounding elements. Use vacuum suction pen sucker gently aligned with the middle of the BGA components can then suck the components, and remove