Product Name: American quality BGA flux paste unleaded environmental flux paste bga solder paste bumping sent to: special brush

Product Category: chip-level maintenance tools - Welding-BGA desoldering tools - BGA solder ball steel net flux and supplies

Product Description:

U.S. Burnley flux paste is applied to the phone PCB, BGA and PGA SMD rework flux paste, which is used in low ionic activator system fast Yun tin, the low level of smoke residues cured surface insulation impedance value is high, therefore, very small DM-200 electrical interference on mobile phones and other communications products for moderate activity rosin flux paste, widely used mobile phone board SMD rework process suitable for the north and south bridge, graphics, mobile phone chip, video games BGA chip Welding, planting the ball, but also can be used off the tin, the effect is very ideal, the absolute value residue less bright solder joints, less smoke, no irritating smell, not run the ball 

Model: DM-200 

Package : 100 grams per bottle