The  AMTECH NC-599-ASM is a high viscosity no-clean flux (it is not Original) that can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.

Feature:
* Touch-up and rework
* Attachment of BGA spheres
* Soldering Flip Chip components
* Excellent wetting compatibility
* Wide reflow window
* Compatible with most board finishes
* Brand:Amtech
* Flux Type:NC-559-ASM
* Volume:100g.

Product Description: 

U.S. AMTECH developed for use in mobile phone PCB, BGA and PGA of SMD rework flux paste, etc., which are used in low ionic activator system, run the tin fast, low smoke degree, high surface insulation resistance value of the residue after curing, therefore, the electrical interference mobile phone and other communication products is very small. 

NC-559 is a no-clean flux paste-type residue color is very light, there is a very high value of SIR, recommended for BGA, CSP, such as solder ball array rework and make balls.